CALL FOR PAPERS
Visual Communications and Image Processing 2005
12-15 July 2005, Beijing, China
Web: http://www.research.microsoft.com/asia/VCIP2005
Email: vcip2005@microsoft.com
Hosted by: Microsoft Research Asia
Sponsored by: SPIE -- The International Society of Optical
Engineering
Technically Co-Sponsored by: IEEE Circuits and Systems Society
Visual communication has become an important engineering area that
attracts interdisciplinary research interest and has lead to significant
developments in technology and science. This conference is designed as a
forum for presenting important research results.
Original and unpublished material of novel techniques and new
developments are solicited on the following and related topics:
1. Image and Video Coding
1.1. image/video coding algorithms
1.2. image/video coding standards
1.3. object/model/content-based coding
1.4. error-resilient video coding
1.5. scalable/layered image/video coding
1.6. distributed coding
2. Visual Communication Techniques
2.1. video streaming techniques
2.2. QoS issue
2.3. wireless video for 2G and 3G
2.4. Internet video
2.5. interactive/broadband video
3. Image and Video Analysis
3.1. image analysis
3.2. image sequence analysis
3.3. motion estimation/compensation
3.4. object segmentation and tracking
3.5. statistical models
4. Image and Video Processing
4.1. multi-resolution processing
4.2. multi-modal media processing
4.3. filtering and interpolation
4.4. restoration, enhancement, and noise reduction
4.5. compressed domain processing techniques
4.6. adaptation/transcoding
5. Image and Video Synthesis and Rendering
5.1. stereo, multiview, and 3D (virtual reality)
5.2. synthetic image/video representations
5.3. graphics techniques in image/video representations
5.4. audio/video integration
5.5. image/video conversion
6. Implementation and Applications
6.1. VLSI implementation
6.2. system architecture
6.3. soft radio technologies
6.4. DTV and electronic cinema
6.5. video and home networking
6.6. video and e-commerce/m-commerce
For paper submission, please go to VCIP’2005 Web,
http://www.research.microsoft.com/asia/VCIP2005/submission.htm and submit
a 1000-word abstract in PDF format by Dec. 20, 2004.
PROPOSAL FOR TUTORIALS, SPECIAL SESSIONS, PANELS AND EXHIBITIONS
Tutorials will be held on July 12, 2005. Proposals for tutorials should
include a title, an outline of the tutorial and its motivation, contact
and bio information for the presenter(s), and a short description of the
material to be covered. Proposals for tutorials should be submitted to
Dr. Wei-Ying Ma (wyma@microsoft.com) by Dec. 20, 2004.
VCIP'2005 will include a number of special sessions and panels. Proposals
for special sessions and panels should be made according to the
guidelines in the VCIP'2005 Call for Special Session
(http://www.research.microsoft.com/asia/vcip2005/special_sessions.htm)
and submitted to Dr. Anthony Vetro (avetro@merl.com) by Dec. 20, 2004
for special sessions and by Jan. 31, 2005 for panels.
VCIP'2005 will also feature a demo session. Proposals of technical
demonstrations should be made according to the guidelines in VCIP'2005
Call for Demos
(http://www.research.microsoft.com/asia/vcip2005/demos.htm) and submitted
to Dr. Xian-Sheng Hua (xshua@microsoft.com) by Dec. 20, 2004.
IMPORTANT DEADLINES:
Abstract for Paper Submission (1000 words):
Due Date: Dec. 20, 2004
Proposals for Tutorials, Special Sessions, and
Exhibitions: Due Date: Dec. 20, 2004
Proposals for Panels:
Due Date: Jan. 31, 2005
Author Notification:
Due Date: Feb. 28, 2005
Final Manuscript (8-12 pages) and Summary (200 words):
Due Date: April 4, 2005
BEST STUDENT PAPER AWARDS
At this meeting, awards will be presented to the two best papers
submitted by a student. To qualify for these awards, each consisting of a
cash prize and a plaque, the candidate must be the principal author. A
letter from the student's advisor stating that the major work was done by
the student must accompany the final manuscript in order to be considered
by the award committee.
YOUNG INVESTIGATOR AWARD
An award will be given for the best paper submitted by a young researcher
who has graduated within five years from the date of the meeting and is
not currently enrolled in a graduate program. A photocopy of the
researcher's most current diploma and a letter from the researcher
requesting that his/her paper be considered must be submitted with the
final manuscript, certifying he/she meets the qualifications for the
award.
ORGANIZING COMMITTEE
GENERAL CO-CHAIRS:
Heung-Yeung Shum, Microsoft Research Asia (China)
Andrew G. Tescher, AGT Associates (USA)
PROGRAM CO-CHAIRS:
Shipeng Li, Microsoft Research Asia (China)
Fernando Pereira, Instituto Superior Tecnico (Portugal)
LOCAL ARRANGEMENT CO-CHAIRS:
Yun He, Tsinghua Univ. (China)
Feng Wu, Microsoft Research Asia (China)
TUTORIAL CO-CHAIRS:
Wei-Ying Ma, Microsoft Research Asia (China)
Kiyoharu Aizawa, Univ. of Tokyo (Japan)
DEMO CO-CHAIRS:
Jiang Li, Microsoft Research Asia (China)
Xian-Sheng Hua, Microsoft Research Asia (China)
PUBLICITY AND INTERNATIONAL LIAISON CHAIR
Gary J. Sullivan, Microsoft Corp. (USA)
SPECIAL SESSION CO-CHAIRS:
John Apostolopoulos, Hewlett-Packard Laboratories (USA)
Anthony Vetro, Mitsubishi Electric Research Laboratories (USA)
ADVISORS:
Hong-Jiang Zhang, Microsoft Research Asia (China)
Ya-Qin Zhang, Microsoft Corporation (USA)
TECHNICAL PROGRAM COMMITTEE
Kiyoharu Aizawa, Univ. of Tokyo (Japan)
Rashid Ansari, Univ. of Illinois/Chicago (USA)
John Apostolopoulos, Hewlett-Packard Laboratories (USA)
Alan C. Bovik, Univ. of Texas/Austin (USA)
Liang-Gee Chen, National Taiwan Univ. (Taiwan)
Tsuhan Chen, Carnegie Mellon Univ. (USA)
Tihao Chiang, National Chiao Tung Univ. (Taiwan)
Edward J. Delp, Purdue Univ. (USA)
Thomas R. Fischer, Washington State Univ.(USA)
Wen Gao, Institute of Computing Technology (China)
Hsueh-Ming Hang, National Chiao Tung Univ., (Taiwan)
Yun He, Tsinghua Univ. (China)
Chiou-Ting Hsu, National Tsing Hua Univ. (Taiwan)
Xian-Sheng Hua, Microsoft Research Asia (China)
Lance M. Kaplan, U.S. Army Research Laboratory (USA)
Alex Kot, Nanyang Technological Univ. (Singapore)
C.C. Jay Kuo, Univ. of Southern California (USA)
Reginald L. Lagendijk, Delft Univ. of Tech. (Netherlands)
Kenneth K. Lam, Hong Kong Polytechnic Univ. (HK)
Bo Li, Hong Kong Univ. of Sci.and Tech. (HK)
Jiang Li, Microsoft Research Asia (China)
Shipeng Li, Microsoft Research Asia (China)
Mark Liao, Institute of Applied Science and Engineering Research (Taiwan)
Ching-Yung Lin, IBM T. J. Watson Research Center (USA)
Xinggang Lin, Tsinghua Univ. (China)
Guan Ling, Ryerson Polytechnic Univ. (Canada)
Wei-Ying Ma, Microsoft Research Asia (China)
Jens-Rainer Ohm, Aachen Univ. of Technology (Germany)
Naohisa Ohta, Sony Corp. (Japan)
Antonio Ortega, Univ. of Southern California
Joern Ostermann, Univ. of Hannover (Germany)
Sethuraman Panchanathan, Arizona State Univ. (USA)
William A. Pearlman, Rensselaer Polytech. Institute (USA)
Fernando Pereira, Instituto Superior Tecnico (Portugal)
Sarah A. Rajala, North Carolina State Univ. (USA)
Majid Rabbani, Eastman Kodak Research Lab. (USA)
Mihaela van der Schaar, Univ. of California/Davis (USA)
Thomas Sikora, Technical Univ. Berlin (Germany)
Hwangjun Song, Hong-Ik Univ. (Korea)
Gary J. Sullivan, Microsoft Corp. (USA)
Huifang Sun, Mitsubishi Electric Research Lab. (USA)
Ming-Ting Sun, Univ. of Washington (USA)
A. Murat Tekalp, Univ. of Rochester (USA)
Anthony Vetro, Mitsubishi Electric Research Lab. (USA)
John W. Woods, Rensselaer Polytech. Institute (USA)
Feng Wu, Microsoft Research Asia (China)
Zixiang Xiong, Texas A&M Univ. (USA)
Bing Zeng, Hong Kong Univ. of Sci. and Tech. (HK)
Qian Zhang, Microsoft Research Asia (China)